2026年台灣國際半導體展（SEMICON Taiwan 2026）即將盛大開幕，我們誠摯邀請您蒞臨參觀台灣創浦攤位，位於南港展覽館二館1樓 P6206。我們致力於以先進技術賦能全球頂尖的半導體製造工藝，涵蓋EUV（極紫外線）微影、先進封裝及下一代電漿電源技術。屆時，我們將展示我們的雷射和電漿電源解決方案如何幫助您在關鍵製造環節中提升精度、良率及產能。

我們的專家團隊將在展位現場為您深入解析以下技術與應用： 

• 客製化雷射光束整形技術：在提高產能的同時降低整體擁有成本
• 應用雷射和HighPulse 4000 G2 的玻璃通孔（TGV）製造技術
• 超短脈衝雷射應用：涵蓋通孔鑽孔、開槽、晶圓切割及退火工藝
• 面向先進刻蝕與沉積製程的電漿電源技術，包括TruPlasma RF G3系列產品

The annual SEMICON Taiwan 2026 is fast approaching, and we sincerely invite you to visit us, at TaiNex Hall 2, 1F P6206. With our technologies we contribute to some of the world's most advanced semiconductor manufacturing processes, including EUV lithography, advanced packaging and next generation plasma technology. We will showcase how our laser and plasma solutions help you boost precision, yield and throughput across critical manufacturing steps.
 
Our experts at the booth will provide insights on:

• Tailored laser beam shaping that increases throughput while lowering Cost of Ownership
• Through Glass Via (TGV) manufacturing 
• Ultra short pulse laser applications for via drilling, grooving, wafer dicing and annealing
• Plasma technologies for advanced etching and deposition processes, including our TruPlasma RF G3 series