How Advanced Packaging Drives the Next Growth Cycle

As AI data centers scale at record speed, chip packaging has become the new battleground shaping the semiconductor industry's future. With surging computing power demands and challenges in latency, thermal management, and energy efficiency, packaging is no longer a back-end process - it now defines chip competitiveness in the generative AI era.

According to the recent research from DIGITIMES, the global leading-edge packaging market is projected to grow at a 26% CAGR from 2024 to 2030, driven by performance-focused integration and innovation. In this webinar, DIGITIMES and Chuck Sobey, Chairman of the Chiplet Summit, will explore how chiplets and heterogeneous integration are transforming high-performance computing and fueling the next wave of AI-driven growth. Register now to gain exclusive insights from industry experts and stay ahead of the next growth cycle.

Highlights of the Event

Forecasting the AI Packaging Boom

Inside the Chiplet and Heterogeneous Integration Revolution

Expert Perspectives on the Next Growth Cycle

2025.12.05(Fri)

8:00am (GMT+8)

Agenda

30 mins

Check-in

5 mins

Opening Remarks

Host

20 mins

Powering the AI Chip Race: Global Advanced Packaging Market Trends and Opportunities

Tony Huang
Director of DIGITIMES

20 mins

Chiplets Reshape Memory-Storage Hierarchy

Chuck Sobey
Chief Scientist of ChannelScience
General Chair of Chiplet Summit

15 mins

Quick Fire Q&A

Eric Huang, Tony Huang & Chuck Sobey

The Organizers / Event Producer reserves the right to amend agenda content.

Speakers

Tony Huang

Director of DIGITMES

Chuck Sobey

Chief Scientist of ChannelScience
General Chair of Chiplet Summit

Charlene Chen

Research Editor

Compaines

More Info

Registration Deadline: The registration deadline is Dec. 1st, 2025. DIGITIMES reserves the right to adjust the deadline or close registration early if capacity is reached.
Attendance Fee: Attendance for this event is free of charge. Advance registration and approval are required for all participants.
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