What's Powering the Next-Gen Power Device Performance

The bar continues to rise. Power semiconductors must meet the expectations of performance and reliability – all while keeping costs competitive. This is especially true for certain automotive and industrial applications.

The big challenge? Controlling the heat. High operational temperatures directly impact device performance and long-term reliability. Efficient heat dissipation is essential. As the industry shifts to bare copper (Cu) designs for cost and reliability advantages, die attach materials that offer high thermal capability and Cu compatibility are critical.

Join Henkel technical experts for an exclusive webinar where we will reveal the details about Polymerization-induced phase separation – a patented technology platform engineered for next-generation power device performance.

You'll learn how Polymerization-induced phase separation is enabling die attach formulations that:

Meet automotive grade 0 thermal cycling and MSL1 reliability standards.
Provide high bulk thermal conductivity for metallized or bare Si die.
Deliver compatiblity with multiple die finish/lead frame combinations, including bare Cu.
Have superior RDS (on) compared to standard die attach materials.
Facilitate Cu wire bonding processes.

This is the first webinar in our Power Device series, designed to help you stay ahead of industry demands.

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