潘大偉自2022年11月22日起擔任英飛凌科技全球資深副總裁暨大中華區總裁，負責公司在大中華區市場的整體業務運營， 並擔任英飛凌消費、計算與通訊業務大中華區負責人。

Adam White has over 20 years of experience in the semiconductor industry. He is currently Division President of Infineon’s Power and Sensor Systems (PSS) division and previously served as the Executive Vice President and Chief Marketing Officer of this division. Prior to Infineon, he was International Rectifier’s Executive Officer and Senior Vice President Worldwide Sales, holding the responsibility for all demand creation activities throughout direct, distribution and representative sales channels globally. Since joining International Rectifier in 1996, Mr. White held a number of engineering positions within the company’s R&D, Marketing and Manufacturing teams.

In addition to his power management semiconductor expertise, Mr. White has extensive global demand creation experience in developing, deploying and managing many aspects of the Sales, Field Application Engineering and Business Development Teams throughout the Americans, Asia, Europe and Japan. Mr. White holds a Diploma in Engineering, Electronic and Electrical Engineering with Industrial, BEng (Hons) DIS, IEEE, from University of Loughborough, United Kingdom.

陳志豪目前擔任英飛凌科技副總裁、消費、計算與通訊業務大中華區技術行銷負責人暨英飛凌台灣董事總經理，執掌英飛凌在台灣的策略布局、營運規劃及業務之推展，同時他也負責消費、計算與通訊業務部在大中華區的技術行銷業務。

邱煌仁教授，目前係國立臺灣科技大學產學創新學院院長，同時也是IEEE, IET, TaiPEA fellow! 邱教授學術專長領域在高功率密度電能轉換器設計、寬帶隙功率元件驅動與應用技術與電磁相容等領域，曾榮獲教育部國家產學大師獎肯定。

Johannes Schoiswohl, Ph.D., Senior Vice President & General Manager at Infineon Technologies Austria AG, since 1st July 2023 Business Line Head of Power & Sensor Systems (PSS) GaN Systems.

He started his career as a technology development engineer at Infineon Austria and became director of application and system engineering for the business line DCDC. During this activity he spent several years at Infineon Technologies North America Corporation, San Francisco. Back in Europe he deepened his experience in the fields of Chips & Discretes and Efficient Power Supplies, Isolation & Connectivity.

Dr. Schoiswohl holds an Ph.D. in Physics from the Karl Franzens University Graz and a Master of Science in Technical Physics from the University of Technology Graz.

Claire Wang joined Infineon Technologies AG in April 2023 as the Chief Operation Officer and Board Member of the Power and Sensing Systems Division. She has more than 20 years of experience in semiconductor and electronic component manufacturing industries with various senior leadership positions in NXP, Nexperia and TE Connectivity with a strong focus on Supply Chain Management, Operations and working with subcontracting manufacturers.

While based in Taiwan, the Netherlands, US, and Germany, she has managed global teams and gained a diversified view of how to establish and lead a productive team across different continents.

Athar Zaidi is a SVP/GM at Infineon Technologies where he manages Power ICs and Connectivity Systems (PCS) Business Line under Power and Sensor Systems (PSS) Division. Athar joined Infineon in 2016, prior to that he held leadership positions at Dialog Semiconductors, Maxim Integrated and Semtech Corporation where he managed global semiconductor businesses focusing on power management in Enterprise, Consumer, Industrial, Telecom and Automotive space. Athar has an MBA from UC Berkeley and Dual MS in Mechanical and Computer Engineering from North Carolina State University.

Richard Kuncic is a Senior Vice President & General Manager Business Line Power Systems, Richard joined Infineon in 1998, he holds a diploma in Mechanical Engineering & Economics from the Technical University of Vienna.

Dr. Gerald Deboy is Fellow at Infineon Technologies. He joined Siemens Corporate Research and Development in 1992 and the Semiconductor Division of Siemens in 1995, which later became Infineon Technologies. Since 2009, he is heading a business development group specializing in new fields for power electronics. Dr. Gerald Deboy received his M.S. and Ph.D. degrees in physics from the Technical University Munich in 1991 and 1996, respectively. He has authored or coauthored more than 100 papers in national and international journals, including contributions to three textbooks. He holds more than 100 granted international patents and has more applications pending. He is a Senior Member of the IEEE.