Chun-Yu Lin received the Ph.D. degree from the Institute of Electronics, National Chiao Tung University, Taiwan, in 2009. He was the Assistant Professor from 2013 to 2017, Associate Professor from 2017 to 2021, and Distinguished Professor from 2021 to 2024, at the Department of Electrical Engineering, National Taiwan Normal University. Starting from 2024, he relocates to join the Institute of Electronics at National Yang Ming Chiao Tung University. Now, he also serves as the President of Taiwan ESD Association.

He authored or co-authored more than 100 conference and journal publications. He is a peer reviewer for the IEEE Electron Device Letters, IEEE Transactions on Microwave Theory and Techniques, IEEE Transactions on Electron Devices, IEEE Transactions on Device and Materials Reliability, IEEE Transactions on Circuits and Systems I, IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, IEEE Microwave and Wireless Components Letters, Microelectronics Reliability, IET Circuits Devices & Systems, and Electronics Letters. His current research interests include ESD protection designs and biomimetic circuit designs.

With over a decade of experience in the semiconductor industry, Xiang boasts a comprehensive background spanning from design flows to foundry process.

Judge Lin is a Calibre AE at Siemens, bringing a powerful perspective with 15 years of experience transitioning from leading IC design houses to the EDA domain. Having managed advanced physical verification and complex tape-out flows from the user side, he deeply understands the real-world challenges faced by design teams. At Siemens, he leverages this extensive design-side expertise to deliver cutting-edge Calibre verification and sign-off solutions.

Alvin Liu holds a Master’s degree in Electrical Engineering from the University of Arizona, United States. He is currently an Applications Engineering Consultant at Siemens EDA, where he provides technical support for Calibre and mPower solutions across the Taiwan and ASEAN regions. With a strong background in electronic design automation (EDA), Alvin specializes in advanced packaging technologies, including 2.5D and 3D IC design verification. His expertise includes reliability and electrical analysis flows such as 3DPERC, as well as layout debugging and visualization using tools like DesignREV and RVE.